exemplar |
ME2P, 170-210u3m |
notus |
Daheng image |
Resolutio |
MDCVIII × MCIV |
Frame rate (FPS) |
210.8 |
Sensor manufacturer |
Sony |
sensor |
1.1 'IMX425 Global Lorem Cmos |
Cell |
9μm |
Pixel profundum |
VIII bits, X bits, XII bits |
Data interface |
Usb3.0 |
Lens interface |
C, CS |
spectro |
Nigrum et Alba |
Image notitia format |
Mono8, Mono10, Mono12 |
Signum-ad-sonitus Ratio |
L DB |
Tempus expositionis |
Minimum: 1μs ~ 5μs; Latin: 9μs ~ 1s |
Produco |
0DB ~ 24DB |
Binning |
FPGA: I × I, I × II, I × IV, II × I, II × II, II × IV, IV × II, IV × IV, IV × IV |
Pixel sampling |
FPGA, I × I, I × II, II × I, II × II |
Speculum Flip |
Speculum horizontalem, vertical Speculum |
I / O interface |
I Optoupouple Solation input, I Optoupouple Solation output, II Bidirectional GPIOS |
Rated potestatem |
<3.4 w @ V VDC |
Vox copia requisita |
USB3.0 interface potentia copia |
Operating temperatus |
0 ° C XLV + ° C |
Storage temperatus |
-20 ° C + LXX ° C |
Operantes humiditas |
X% ~ LXXX% |
Mechanica magnitudine (W × h × L) |
XXXVI mm × XXXI mm × 38.8 mm |
pondus |
LXVI g |
Certification et signa |
CE, Rohs, FCC, ices, UKCA, USB3.0 Vision, Genica |