exemplar | ME2P, 170-210u3m |
notus | Daheng image |
Resolutio | MDCVIII × MCIV |
Frame rate (FPS) | 210.8 |
Sensor manufacturer | Sony |
sensor | 1.1 'IMX425 Global Lorem Cmos |
Cell | 9μm |
Pixel profundum | VIII bits, X bits, XII bits |
Data interface | Usb3.0 |
Lens interface | C, CS |
spectro | Nigrum et Alba |
Image notitia format | Mono8, Mono10, Mono12 |
Signum-ad-sonitus Ratio | L DB |
Tempus expositionis | Minimum: 1μs ~ 5μs; Latin: 9μs ~ 1s |
Produco | 0DB ~ 24DB |
Binning | FPGA: I × I, I × II, I × IV, II × I, II × II, II × IV, IV × II, IV × IV, IV × IV |
Pixel sampling | FPGA, I × I, I × II, II × I, II × II |
Speculum Flip | Speculum horizontalem, vertical Speculum |
I / O interface | I Optoupouple Solation input, I Optoupouple Solation output, II Bidirectional GPIOS |
Rated potestatem | <3.4 w @ V VDC |
Vox copia requisita | USB3.0 interface potentia copia |
Operating temperatus | 0 ° C XLV + ° C |
Storage temperatus | -20 ° C + LXX ° C |
Operantes humiditas | X% ~ LXXX% |
Mechanica magnitudine (W × h × L) | XXXVI mm × XXXI mm × 38.8 mm |
pondus | LXVI g |
Certification et signa | CE, Rohs, FCC, ices, UKCA, USB3.0 Vision, Genica |