exemplar |
Martis, 10300-24x2c, TF |
notus |
Daheng image |
Resolutio |
(IX) CC (XI) CCLXIV × |
Frame rate (FPS) |
24 |
Sensor manufacturer |
GPIXEL |
sensor |
36.1MM × 29.4mm GMAX32103 103MP Global Lorem CMOS |
Cell |
3.2μm |
Pixel profundum |
VIII bits, XII bits |
Data interface |
Coaxprest 2.0 |
Lens interface |
M72 |
spectro |
colo |
Image notitia format |
Bayer GB8, Bayer GB12 |
Signum-ad-sonitus Ratio |
40,3 DB |
Tempus expositionis |
20μs ~ 1s |
Produco |
0DB ~ 16DB |
Binning |
I × I, I × II, I × IV, II × I, II × II, II × IV, IV × II, IV × II, IV × IV, IV × II, IV × IV |
Pixel sampling |
Horizontal FPGA, vertical sensor: 1×1, 1×2, 1×4, 2×1, 2×2, 2×4, 4×1, 4×2, 4×4 |
Speculum Flip |
Speculum horizontalem, vertical Speculum |
I / O interface |
I Optoupouple Solation input, I Optoupouple Solation output, I Bidirectional GPio, I Rs232 |
Rated potestatem |
Rated Power: 24W 24v, environment XXV ℃, sensorem constans temperatus X ℃, TEC (ad), fan (a); Maximum Power: 30W @ Fast Refrigerant scaena (TEC (on), Fan (a)) |
Vox copia requisita |
Auxiliares DC 24V potentia copia aut Pocxp potestas copia |
Operating temperatus |
0 ° C XLV + ° C |
Storage temperatus |
-20 ° C + LXX ° C |
Operantes humiditas |
X% ~ LXXX% |
Mechanica magnitudine (W × h × L) |
100mm × 100mm × 112.3mm |
Calor dissipatio modum |
TEC semiconductor refrigerationem + fan |
pondus |
MDCX g |
Certification et signa |
CE, coaxpress 2.0, GENL |