model | ME2P-170-210U3C |
jenama | Imej Daheng |
Resolusi | 1608 × 1104 |
Kadar Bingkai (FPS) | 210.8 |
Pengilang Sensor | Sony |
sensor | 1.1 'IMX425 Global Shutter CMOS |
Saiz sel | 9μm |
Kedalaman Pixel | 8 bit, 10 bit, 12 bit |
Antara muka data | USB3.0 |
Antara muka kanta | C, cs |
spektrum | warna |
Format data imej | Bayer RG8, Bayer RG10, Bayer RG12 |
Nisbah isyarat-ke-bunyi | 49.9 dB |
Masa dedahan | Minimum: 1μs ~ 5μs; Standard: 9μs ~ 1s |
Keuntungan | 0db ~ 24db |
Binning | FPGA: 1 × 1, 1 × 2, 1 × 4, 2 × 1, 2 × 2, 2 × 4, 4 × 1, 4 × 2, 4 × 4 |
Pensampelan piksel | FPGA: 1 × 1, 1 × 2, 2 × 1, 2 × 2 |
Cermin flip | Cermin mendatar, cermin menegak |
I/O Interface | 1 input pengasingan optokopel, 1 output pengasingan optokopel, 2 GPIOS BIDIRECTIONAL |
Kuasa dinilai | <3.4 W @ 5 VDC |
Keperluan bekalan kuasa | Bekalan Kuasa Antara Muka USB3.0 |
Suhu operasi | 0 ° C ~ +45 ° C. |
Suhu penyimpanan | -20 ° C ~ +70 ° C. |
Kelembapan bekerja | 10% ~ 80% |
Saiz mekanikal (w × h × l) | 36 mm × 31 mm × 38.8 mm |
berat | 66 g |
Pensijilan dan piawaian | CE, ROHS, FCC, ICES, UKCA, USB3.0 Visi, Genicam |